Senior Manager - Khairul

Khairul Anuar Muhammad


Senior Manager at Proton



Location

Malaysia

Industry

Automotive

Previous NXP Semiconductor Malaysia, Philips Semiconductor Seremban, Jurusan Suria Sdn.Bhd.

Education MBA, Finance at Universiti Tun Abdul Razak


(Oct 2011- present) Proton - Senior Manager - Strategic Management.



(June 2010 – Sept 2011) NXP Semiconductor Malaysia – QA Manager IPQA



(Oct 2006 – May 2010) NXP Semiconductor Malaysia – Purchasing Senior Section Head(Formerly known as Philips Semiconductor Seremban)



( July 2003 – Sept 2006) Philips Semiconductor Seremban – Process & Equipment Engineer.



( August 2001 – May 2003) Jurusan Suria - Production Manager, Operations (Shah Alam)



(June 2000 – June 2001) Process Engineer/FA at Perai Seagate Storage products.



Specialties

Purchasing - Cost management.

Engineering - Process Engineering.



Experience

Senior Manager Proton Privately Held; 10,001+ employees; Automotive industry



October 2011 – Present (1 year 2 months) Shah Alam



Group Technical Procurement for Strategic Management.

• Accountable for the preparation, managing supplier relation between vendor and Proton• Accountable for the fact-based choices in selecting, categorizing and developing supply base together with technical sourcing division BICEP.

• Maintain close relationship with supplier’s global account manager, to ensure proper deployment of Proton's requirements at supplier and be the focal point for any escalation towards supplier.

• Accountable for regular performance (supplier rating) & business reviews with suppliers.

• Ensure involvement of suppliers in product creation process and facilitate supplier integration in Proton vendor network by meeting QCD.



QA Manager IPQA Section NXP Semiconductor Malaysia Public Company; 10,001+ employees; NXPI; Semiconductors industry



June 2010 – September 2011 (1 year 4 months)



Practical Job Responsibilities: In-coming Quality / Supplier Development

• Develop/Qualify/Audit suppliers to ensure quality of all incoming direct material meet the requirements of NXP and APM specs.

• Monitor/Review/propose Quality improvement actions for incoming material.

• Conduct supplier audits to ensure QMS of suppliers meet the expectations of APM’s requirement.



Product Quality Improvement

• Monitor and plan improvement activities to ensure final product shipped meet the specifications and expectations for customers.



Section Head NXP Semiconductors Public Company; 10,001+ employees; NXPI; Semiconductors industry



October 2006 – May 2010 (3 years 8 months)



Sourcing:

• Responsible for the execution of the sourcing strategies by site teams: analyze and monitor the actual execution of the sourcing strategy.

• Develop, update and review the purchasing budget, price roadmap & actual pricing for complete site portfolio.



Supplier relationships:

• Accountable for the preparation, conclusion and execution of contracts with suppliers in order to cover semiconductor risks and to optimize results on the aspects like supply volume and flexibility, product specifications, quality and reliability levels, and pricing: settle and justify all commercial/pricing agreements.

• Accountable for the fact-based choices in selecting, categorizing and developing supply base together with global commodity/cluster team.

• Accountable for regular performance (supplier rating) & business reviews with suppliers.



Operational Excellence:

• Report and manage performance measurement for site and drive improvement projects, so that business requirements and objectives are met.



Process & Equipment Engineer Philips Semiconductor Seremban

July 2003 – September 2006 (3 years 3 months)



• Front- End process assembly, Die bond and Wire bond. Lot disposition for on hold Lot due to quality defect. Analysis and data compilation.

• Die bond - The Adat 2 Mk 4 is an automatic, high speed reel to reel die bonding system. All adat 2 based die bonders consists of the following main modules: Die transfer unit. Die transfer system is a transfer arm which picks up the die from the wafer and places the die on the lead frame. Waferhandling unit . Workholder. Depending on the application, different workholders are available. Vision (Pattern Recognition System - PRS)

• System control, Utilities, Operating devices, Cabinets.

• Wire bond - The Phicom 3 Mk 4 is an automatic reel to reel wire bonding system for the attachment of gold wires from the die to the leadframe (ball-wedge bonding).It is especially suitable to be used in high volume/high speed assembly for discrete products



Production Manager Jurusan Suria Sdn.Bhd.

July 2001 – January 2003 (1 year 7 months)



· Major responsibilities are to lead production team to ensure the achievement of target quantity, quality & delivery time at a minimum cost.

· Setting department goals, target & objectives; Improving production system; process quality, yield efficiency.

· Ensure daily production activities are running smoothly to achieve targeted output.

· Work closely with planning department to ensure manpower are managed and utilized to the fullest potential.

· Ensure continuous training for total multi-skill workforce to support production flexibility.

· Reporting to the General Manager, the incumbent is responsible for the smooth running of all production activities. Besides ensuring all production targets and schedule are met high quality standard must be maintained at all times.



Education

Universiti Tun Abdul Razak MBA, Finance

2006 – 2008





Universiti Teknologi MARA B. Eng Hons Electrical, Electrical & Electronics

1995 – 1998





University of Arizona

Personal Information

Birthday:August 6






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